Invention Grant
- Patent Title: Memory module data buffer
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Application No.: US17162962Application Date: 2021-01-29
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Publication No.: US11698870B2Publication Date: 2023-07-11
- Inventor: William A. Lendvay
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: G06F13/16
- IPC: G06F13/16 ; G06F13/42 ; G11C11/00

Abstract:
The present disclosure includes apparatuses and methods related to a data buffer in a non-volatile dual in-line memory module (NVDIMM). An example apparatus can include a data buffer couplable to a host, a first memory device (e.g., volatile memory), wherein the first memory device is coupled to the data buffer via a first bus, a second memory device (e.g., non-volatile memory), and a controller, wherein the controller is coupled to the data buffer via a second bus and wherein the controller is configured to cause a data transfer from first memory device to the second memory device via the data buffer and the second bus.
Public/Granted literature
- US20220206965A1 MEMORY MODULE DATA BUFFER Public/Granted day:2022-06-30
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