Invention Grant
- Patent Title: System on chip and device layer
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Application No.: US17845544Application Date: 2022-06-21
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Publication No.: US11698880B2Publication Date: 2023-07-11
- Inventor: Shun-Hsiung Chen
- Applicant: Nuvoton Technology Corporation
- Applicant Address: TW Hsinchu
- Assignee: NUVOTON TECHNOLOGY CORPORATION
- Current Assignee: NUVOTON TECHNOLOGY CORPORATION
- Current Assignee Address: TW Hsinchu Science Park
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW 9120752 2020.06.19
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G16Y10/75 ; G16Y30/10

Abstract:
A system on chip including a first master circuit, a second master circuit, a routing circuit, a bridge control circuit, and a peripheral circuit is provided. The first master circuit provides a first command. The second master circuit provides a second command. The routing circuit receives the first command and the second command and provides an output command. The bridge control circuit receives the output command and stores an attribute setting value. In response to the routing circuit receiving the first command and the first command pointing to the peripheral circuit, the routing circuit uses the first command as the output command and the bridge control circuit determines whether attribute information of the output command matches the attribute setting value. In response to the attribute information of the output command matching the attribute setting value, the bridge control circuit provides the output command to the peripheral circuit.
Public/Granted literature
- US20220318175A1 SYSTEM ON CHIP AND DEVICE LAYER Public/Granted day:2022-10-06
Information query