Invention Grant
- Patent Title: RFID inlay
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Application No.: US17096327Application Date: 2020-11-12
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Publication No.: US11699056B2Publication Date: 2023-07-11
- Inventor: Noriyuki Ueki , Noboru Kato
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo
- Agency: ArentFox Schiff LLP
- Priority: JP 19172969 2019.09.24
- Main IPC: G06K19/07
- IPC: G06K19/07 ; G06K19/077

Abstract:
An RFID inlay includes an RFID module and an antenna. The RFID module includes an RFIC and an antenna sharing circuit provided between the RFIC and the antenna. The RFIC includes a power receiving terminal to which power induced upon receipt of an electromagnetic wave for power reception is input and a transmitting terminal from which a transmission signal for RFID is output. Moreover, the antenna receives the electromagnetic wave for power reception and generates an electromagnetic wave for RFID.
Public/Granted literature
- US20210089851A1 RFID INLAY Public/Granted day:2021-03-25
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