- Patent Title: Systems and methods for overmolding a card to prevent chip fraud
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Application No.: US17675316Application Date: 2022-02-18
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Publication No.: US11699058B2Publication Date: 2023-07-11
- Inventor: Daniel Herrington , Stephen Schneider , Tyler Maiman
- Applicant: Capital One Services, LLC
- Applicant Address: US VA McLean
- Assignee: CAPITAL ONE SERVICES, LLC
- Current Assignee: CAPITAL ONE SERVICES, LLC
- Current Assignee Address: US VA McLean
- Agency: Hunton Andrews Kurth LLP
- Main IPC: G06K19/073
- IPC: G06K19/073 ; G06Q20/34 ; H01L23/00
Abstract:
Systems and methods for overmolding a card are provided. A chip fraud prevention system include a device including a chip and a substrate. The chip may be at least partially encompassed in a chip pocket, and the substrate may be at least partially encompassed by the overmold.
Public/Granted literature
- US20220172014A1 SYSTEMS AND METHODS FOR OVERMOLDING A CARD TO PREVENT CHIP FRAUD Public/Granted day:2022-06-02
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