Invention Grant
- Patent Title: Magnetic thin film laminated structure deposition method
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Application No.: US16386750Application Date: 2019-04-17
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Publication No.: US11699541B2Publication Date: 2023-07-11
- Inventor: Yujie Yang , Peijun Ding , Tongwen Zhang , Wei Xia , Hougong Wang
- Applicant: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Current Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN 1610929057.9 2016.10.31
- Main IPC: H01F3/02
- IPC: H01F3/02 ; H01F41/18 ; H01F41/32 ; H01F10/30 ; H01F41/02 ; H01F17/04 ; H01F27/26 ; H01F41/14 ; H01F10/14

Abstract:
A deposition method includes depositing an adhesive layer on a workpiece to be processed and depositing a magnetic/isolated unit, where the magnetic/isolation unit includes at least one pair of a magnetic film layer and an isolation layer that are alternately disposed. The deposition method of the magnetic thin film laminated structure, the magnetic thin film laminated structure and the micro-inductive device provided by the disclosure can increase a total thickness of the magnetic thin film laminated structure, thereby broadening the application frequency range of the inductive device fabricated thereby.
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