Invention Grant
- Patent Title: Coil structure
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Application No.: US17128331Application Date: 2020-12-21
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Publication No.: US11699545B2Publication Date: 2023-07-11
- Inventor: Ge Li , Junpei Sawayama
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP 19232038 2019.12.23
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F27/26 ; H01F27/28

Abstract:
The first core includes a main body part extending in a first direction along a main surface of the substrate, a first foot part extending from the main body part to the second core through the substrate, and a second foot part extending from the main body part to the second core through the substrate at a position at which the coil conductor is sandwiched between itself and the first foot part in the first direction, and the insulating member includes a bottom wall part interposed between at least the first foot part and the second core, and a side wall part extending along at least either of the first foot part and the second foot part and interposed between either of the foot parts and the coil conductor.
Public/Granted literature
- US20210193364A1 COIL STRUCTURE Public/Granted day:2021-06-24
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