A module that improves heat-dissipation efficiency and can prevent a warp and a deformation of the module is provided. A module includes a substrate, a first component mounted on an upper surface of the substrate, a heat-dissipation member, and a sealing resin layer that seals the first component and the heat-dissipation member. The heat-dissipation member is formed to be larger than the area of the first component when viewed in a direction perpendicular to the upper surface of the substrate and prevents heat generation of the module by causing the heat generated from the first component to move outside the module. The heat-dissipation member has through holes, and the through holes are packed with a resin, which can prevent the sealing resin layer from peeling off.