Invention Grant
- Patent Title: Semiconductor device and method for manufacturing same
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Application No.: US17371586Application Date: 2021-07-09
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Publication No.: US11699672B2Publication Date: 2023-07-11
- Inventor: Mariko Fujieda , Kazuaki Mawatari , Shinji Kawano
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP 16246981 2016.12.20 JP 17061559 2017.03.27
- The original application number of the division: US16392881 2019.04.24
- Main IPC: H01L23/00
- IPC: H01L23/00 ; G01L19/06 ; H01L29/84 ; G01L9/00
Abstract:
A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.
Public/Granted literature
- US20210335740A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2021-10-28
Information query
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