Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17677983Application Date: 2022-02-22
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Publication No.: US11699705B2Publication Date: 2023-07-11
- Inventor: Yen-Wei Tung , Jen-Yu Wang , Cheng-Tung Huang , Yan-Jou Chen
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: TW 6121517 2017.06.28
- The original application number of the division: US15660970 2017.07.27
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L29/66 ; H01L29/06 ; H01L27/02 ; H01L29/78 ; H01L29/49 ; H01L29/51 ; H01L29/423 ; H01L29/165 ; H01L21/8238 ; H01L21/3213 ; H01L21/762 ; H01L21/02

Abstract:
A semiconductor device includes a PMOS region and a NMOS region on a substrate, a first fin-shaped structure on the PMOS region, a first single diffusion break (SDB) structure in the first fin-shaped structure, a first gate structure on the first SDB structure, and a second gate structure on the first fin-shaped structure. Preferably, the first gate structure and the second gate structure are of different materials and the first gate structure disposed directly on top of the first SDB structure is a polysilicon gate while the second gate structure disposed on the first fin-shaped structure is a metal gate in the PMOS region.
Public/Granted literature
- US20220181324A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2022-06-09
Information query
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