Invention Grant
- Patent Title: Solid-state imaging device with layered microlenses and method for manufacturing same
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Application No.: US17543590Application Date: 2021-12-06
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Publication No.: US11699712B2Publication Date: 2023-07-11
- Inventor: Yoichi Ootsuka , Tomoyuki Yamashita , Kiyotaka Tabuchi , Yoshinori Toumiya , Akiko Ogino
- Applicant: Sony Group Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Group Corporation
- Current Assignee: Sony Group Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JP 11217423 2011.09.30
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L27/146 ; H04N25/00
Abstract:
A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.
Public/Granted literature
- US20220093670A1 SOLID-STATE IMAGING DEVICE WITH LAYERED MICROLENSES AND METHOD FOR MANUFACTURING SAME Public/Granted day:2022-03-24
Information query
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