Invention Grant
- Patent Title: Semiconductor device with gate dielectric formed using selective deposition
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Application No.: US17586083Application Date: 2022-01-27
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Publication No.: US11699739B2Publication Date: 2023-07-11
- Inventor: Tung-Ying Lee , Tse-An Chen , Tzu-Chung Wang , Miin-Jang Chen , Yu-Tung Yin , Meng-Chien Yang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. , NATIONAL TAIWAN UNIVERSITY , NATIONAL TAIWAN NORMAL UNIVERSITY
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.,NATIONAL TAIWAN UNIVERSITY,NATIONAL TAIWAN NORMAL UNIVERSITY
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.,NATIONAL TAIWAN UNIVERSITY,NATIONAL TAIWAN NORMAL UNIVERSITY
- Current Assignee Address: TW Hsinchu; TW Taipei; TW Taipei
- Agency: Maschoff Brennan
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/28 ; H01L29/786 ; H01L29/06 ; H01L29/423 ; H01L29/78 ; H01L21/02

Abstract:
A semiconductor device includes source and a drain above a substrate and spaced apart along a first direction, and a semiconductor channel extending between the source and the drain. The semiconductor device further includes gate spacers, an interfacial layer, and a metal gate structure. The gate spacers are disposed on the semiconductor channel and spaced apart by a spacer-to-spacer distance along the first direction. The interfacial layer is on the semiconductor channel. The interfacial layer extends a length along the first direction, and the length is less than a minimum of the spacer-to-spacer distance along the first direction. The metal gate structure is over the interfacial layer.
Public/Granted literature
- US20220149177A1 SEMICONDUCTOR DEVICE WITH GATE DIELECTRIC FORMED USING SELECTIVE DEPOSITION Public/Granted day:2022-05-12
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