Invention Grant
- Patent Title: Semiconductor device and semiconductor apparatus
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Application No.: US17359983Application Date: 2021-06-28
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Publication No.: US11699744B2Publication Date: 2023-07-11
- Inventor: Kazuya Konishi , Koichi Nishi , Akihiko Furukawa
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP 20189650 2020.11.13
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L29/66 ; H01L29/20 ; H01L29/16 ; H01L29/10

Abstract:
A semiconductor device includes; a semiconductor substrate; an emitter electrode provided on the semiconductor substrate; a gate electrode provided on the semiconductor substrate; a drift layer of a first conduction type provided in the semiconductor substrate; a source layer of the first conduction type provided on an upper surface side of the semiconductor substrate; a base layer of a second conduction type provided on the upper surface side of the semiconductor substrate; a collector electrode provided below the semiconductor substrate; and a two-part dummy active trench including, at an upper part, an upper dummy part not connected with the gate electrode and including, at a lower part, a lower active part connected with the gate electrode and covered by an insulating film, in a trench of the semiconductor substrate, wherein a longitudinal length of the lower active part is larger than a width of the lower active part.
Public/Granted literature
- US20220157976A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR APPARATUS Public/Granted day:2022-05-19
Information query
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