Invention Grant
- Patent Title: Laterally diffused MOSFET and method of fabricating the same
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Application No.: US17165165Application Date: 2021-02-02
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Publication No.: US11699752B2Publication Date: 2023-07-11
- Inventor: Zheng Long Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. , TSMC CHINA COMPANY, LIMITED
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,TSMC CHINA COMPANY, LIMITED
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,TSMC CHINA COMPANY, LIMITED
- Current Assignee Address: TW Hsinchu; CN Songjiang
- Agency: Hauptman Ham, LLP
- Priority: CN 2011083543.6 2020.10.12
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/66 ; H01L29/417

Abstract:
A semiconductor device includes a first semiconductor region having a first conductivity type and a second semiconductor region having a second conductivity type, a source region and a body contact region in the second semiconductor region. The semiconductor device also includes a channel region, in the second semiconductor region, located laterally between the source region and the first semiconductor region, a gate dielectric layer overlying both the channel region and a portion of the first semiconductor region, and a gate electrode overlying the gate dielectric layer. The semiconductor device further includes a conformal conductive layer covering an upper surface of the body contact region and a side surface of the source region.
Public/Granted literature
- US20220115534A1 LATERALLY DIFFUSED MOSFET AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-04-14
Information query
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