Invention Grant
- Patent Title: Array substrate and preparation method thereof, and digital microfluidic chip
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Application No.: US17044027Application Date: 2020-03-19
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Publication No.: US11699772B2Publication Date: 2023-07-11
- Inventor: Xue Dong , Yue Geng , Peizhi Cai
- Applicant: Beijing BOE Sensor Technology Co., Ltd. , BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: Beijing BOE Sensor Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee: Beijing BOE Sensor Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing; CN Beijing
- Agency: IPro, PLLC
- Priority: CN 1910256479.8 2019.04.01
- International Application: PCT/CN2020/080258 2020.03.19
- International Announcement: WO2020/199936A 2020.10.08
- Date entered country: 2020-09-30
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L27/144 ; H01L31/0224 ; B01L3/00

Abstract:
Disclosed are an array substrate and a preparation method thereof, and a digital microfluidic chip. The preparation method includes: forming a plurality of photoelectric detection devices on a silicon-based substrate; transferring the photoelectric detection devices to a base substrate by adopting a micro transfer printing process; and forming a plurality of transparent driving electrodes on the base substrate, wherein the transparent driving electrodes are insulated from the photoelectric detection devices.
Public/Granted literature
- US20210367094A1 ARRAY SUBSTRATE AND PREPARATION METHOD THEREOF, AND DIGITAL MICROFLUIDIC CHIP Public/Granted day:2021-11-25
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