Invention Grant
- Patent Title: Antenna module
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Application No.: US17179476Application Date: 2021-02-19
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Publication No.: US11699855B2Publication Date: 2023-07-11
- Inventor: Kyung In Kang , Jeong Ki Ryoo , Kyu Bum Han
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR 20180046816 2018.04.23 KR 20180090870 2018.08.03
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01Q1/22 ; H01L23/498 ; H01L23/66 ; H01L23/00 ; H01Q21/06

Abstract:
An antenna module includes a ground layer including a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via; a coupling patch pattern spaced apart from the patch antenna pattern; a first dielectric layer to accommodate the patch antenna pattern and the coupling patch pattern; a second dielectric layer to accommodate at least a portion of the feed via and the ground layer; and electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer.
Public/Granted literature
- US20210175629A1 ANTENNA MODULE Public/Granted day:2021-06-10
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