Invention Grant
- Patent Title: Using encapsulated flexible substrate to link sensors and electronics in a catheter assembly
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Application No.: US15834623Application Date: 2017-12-07
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Publication No.: US11700695B2Publication Date: 2023-07-11
- Inventor: Shemer Shmaryau Berkowitz , Sharona Ben Shoshan , Eden Kidishman
- Applicant: Biosense Webster (Israel) Ltd.
- Applicant Address: IL Yokneam
- Assignee: BIOSENSE WEBSTER (ISRAEL) LTD.
- Current Assignee: BIOSENSE WEBSTER (ISRAEL) LTD.
- Current Assignee Address: IL Yokneam
- Agency: Volpe Koenig
- Main IPC: H05K3/28
- IPC: H05K3/28 ; A61B5/287 ; H01R43/26 ; A61B5/06 ; A61B5/00 ; A61B18/14 ; A61M25/00 ; A61B18/00 ; H05K1/02 ; A61B90/00

Abstract:
A method for assembling a catheter is disclosed. The method includes printing conductive traces on at least one flexible substrate and encapsulating the at least one flexible substrate to provide for environmental protection. The at least one encapsulated flexible substrate is inserted into a shaft of a catheter. Then, connectors are attached to each end of the at least one encapsulated flexible substrate. One set of the connectors are further attached to sensors located at a distal end of the catheter and another set of the connectors are further attached to electronics in a handle of the catheter.
Public/Granted literature
- US20190175056A1 CATHETER AND METHOD FOR CATHETER ASSEMBLY Public/Granted day:2019-06-13
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