Invention Grant
- Patent Title: Multilayer substrate and antenna element
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Application No.: US16908827Application Date: 2020-06-23
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Publication No.: US11700697B2Publication Date: 2023-07-11
- Inventor: Saneaki Ariumi , Tomoshige Furuhi , Sho Suzuki
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP 18013852 2018.01.30
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H05K3/46 ; H01P3/08 ; H01Q13/08 ; H05K1/09 ; H05K3/38

Abstract:
The insertion loss of a multilayer substrate and an antenna element is reduced. A multilayer substrate according to an embodiment of the present disclosure includes a multilayer body, a wire conductor, and a first ground electrode. The multilayer body is formed by dielectric layers being layered. The wire conductor is formed in the multilayer body, and a radio frequency signal passes through the wire conductor. The first ground electrode is formed in or on the multilayer body and includes a first surface that faces the wire conductor. The first surface includes a first region and a second region. The surface roughness of the first region is lower than the surface roughness of the second region. The first region overlaps at least part of the wire conductor in plan view in a direction normal to the first ground electrode.
Public/Granted literature
- US20200344896A1 MULTILAYER SUBSTRATE AND ANTENNA ELEMENT Public/Granted day:2020-10-29
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