Invention Grant
- Patent Title: Memory device and method for fabricating the same
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Application No.: US17718849Application Date: 2022-04-12
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Publication No.: US11700725B2Publication Date: 2023-07-11
- Inventor: Kangsik Choi
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR 20190178427 2019.12.30
- Main IPC: H10B12/00
- IPC: H10B12/00 ; G11C11/408 ; G11C11/4097

Abstract:
A memory device includes a substrate, an active layer that is spaced apart from the substrate and laterally oriented, a word line that is laterally oriented in parallel to the active layer along one side of the active layer, an active body that is vertically oriented by penetrating through the active layer, a bit line that is vertically oriented by penetrating through the active layer to be spaced apart from one side of the active body, and a capacitor that is vertically oriented by penetrating through the active layer to be spaced apart from another side of the active body.
Public/Granted literature
- US20220238527A1 MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2022-07-28
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