Invention Grant
- Patent Title: Assembly of piezoelectric material substrate and support substrate, and method for manufacturing said assembly
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Application No.: US16834159Application Date: 2020-03-30
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Publication No.: US11700771B2Publication Date: 2023-07-11
- Inventor: Yuji Hori , Takahiro Yamadera , Tatsuro Takagaki
- Applicant: NGK INSULATORS, LTD.
- Applicant Address: JP Nagoya
- Assignee: NGK INSULATORS, LTD.
- Current Assignee: NGK INSULATORS, LTD.
- Current Assignee Address: JP Nagoya
- Agency: Flynn Thiel, P.C.
- Priority: JP 17252831 2017.12.28
- Main IPC: H10N30/072
- IPC: H10N30/072 ; C30B29/30 ; H03H3/08 ; H03H9/25 ; H10N30/20 ; H10N30/086 ; H10N30/88 ; H10N30/853

Abstract:
A bonded body includes a supporting substrate, silicon oxide layer provided on the supporting substrate, and a piezoelectric material substrate provided on the silicon oxide layer and composed of a material selected from the group consisting of lithium niobate, lithium tantalate and lithium niobate-lithium tantalite. A nitrogen concentration at an interface between the piezoelectric material substrate and silicon oxide layer is higher than a nitrogen concentration at an interface between the silicon oxide layer and the supporting substrate.
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