Invention Grant
- Patent Title: Microneedle patch applicator and housing for same
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Application No.: US17479070Application Date: 2021-09-20
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Publication No.: US11701507B2Publication Date: 2023-07-18
- Inventor: Katsunori Kobayashi , Hidetoshi Hamamoto
- Applicant: MEDRX CO., LTD.
- Applicant Address: JP Higashikagawa
- Assignee: MEDRX CO., LTD.
- Current Assignee: MEDRX CO., LTD.
- Current Assignee Address: JP Higashikagawa
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: WO TJP2015085707 2015.12.21 JP 16158930 2016.08.12
- Main IPC: A61M37/00
- IPC: A61M37/00 ; A61K9/00

Abstract:
A microneedle patch applicator housing, being formed from a single sheet or film having a top surface and an undersurface, the housing including a flat peripheral base part and a raised part surround by the peripheral base part and bulging vertically, with respect to the peripheral base part, from the undersurface toward the top surface, an undersurface portion of the raised part forming a surface supporting a microneedle patch, the raised part including a plurality of concavely bent parts, and the concavely bent parts each having a concave bottom toward a direction away from a center portion of the raised part.
Public/Granted literature
- US20220001160A1 MICRONEEDLE PATCH APPLICATOR AND HOUSING FOR SAME Public/Granted day:2022-01-06
Information query
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