Invention Grant
- Patent Title: Manufacturing method of a transfer-molded inductor
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Application No.: US16443808Application Date: 2019-06-17
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Publication No.: US11701805B2Publication Date: 2023-07-18
- Inventor: Xinshu Yu , Shengcheng Xia
- Applicant: Shenzhen Sunlord Electronics Co., Ltd.
- Applicant Address: CN Guangdong
- Assignee: Shenzhen Sundlord Electronics Co., Ltd.
- Current Assignee: Shenzhen Sundlord Electronics Co., Ltd.
- Current Assignee Address: CN Guangdong
- Agent Winston Hsu
- Main IPC: B29C45/02
- IPC: B29C45/02 ; B29C45/00 ; H01F27/30

Abstract:
Disclosed are a transfer-molded inductor and a manufacturing method thereof. The inductor comprises a magnet formed by transfer molding with a soft magnetic colloid; and a prefabricated coil assembly comprising an air-core coil and electrode sheets connected at two ends of the air-core coil. The method comprises steps of: connecting a prefabricated air-core coil and an electrode sheet by welding to form a coil assembly, and placing the coil assembly in a cavity of a mold; performing transfer molding with a soft magnetic colloid in a gelatinous state so that the coil is entirely buried in the colloid while the electrode sheets at two ends of the air-core coil are at least partially exposed outside the colloid to serve as terminal electrodes; and performing demolding after the colloid is cured to form a magnet, and finishing the terminal electrodes to obtain the inductor.
Public/Granted literature
- US20200086536A1 TRANSFER-MOLDED INDUCTOR AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-03-19
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