Invention Grant
- Patent Title: Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board
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Application No.: US17264528Application Date: 2019-06-28
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Publication No.: US11702504B2Publication Date: 2023-07-18
- Inventor: Shohei Yamaguchi , Katsuya Tomizawa , Norihiro Shida , Hidetoshi Kawai
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP 18150563 2018.08.09
- International Application: PCT/JP2019/025921 2019.06.28
- International Announcement: WO2020/031545A 2020.02.13
- Date entered country: 2021-01-29
- Main IPC: C08G59/50
- IPC: C08G59/50 ; B32B15/14 ; H05K1/03 ; B32B5/02 ; C08G59/24 ; C08G59/68 ; C08J5/24 ; B32B5/26 ; B32B15/20 ; C08G59/40 ; C08G59/62
Abstract:
A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.
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