Invention Grant
- Patent Title: Compound for release agent and method for preparing the same
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Application No.: US16972783Application Date: 2020-08-26
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Publication No.: US11702554B2Publication Date: 2023-07-18
- Inventor: Hyun Joong Kim , Hong Chul Kim , Sung-Do Lee
- Applicant: CEKO CO., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: CEKO CO., LTD.
- Current Assignee: CEKO CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20190114634 2019.09.18
- International Application: PCT/KR2020/011357 2020.08.26
- International Announcement: WO2021/054632A 2021.03.25
- Date entered country: 2020-12-07
- Main IPC: C09D5/20
- IPC: C09D5/20 ; C07C43/174 ; C07C69/63 ; C07C271/14 ; C07C271/28 ; C23C14/12 ; C23C14/24
Abstract:
The present invention relates to a compound for release agent and method for preparing the same, and more specifically, to a compound for a release agent that can be coated in an ultra-thin form without thermal deformation even when heat is continuously or discontinuously applied in a continuous evaporator, and a method for preparing the same.
Public/Granted literature
- US20210261795A1 COMPOUND FOR RELEASE AGENT AND METHOD FOR PREPARING THE SAME Public/Granted day:2021-08-26
Information query
IPC分类:
