Invention Grant
- Patent Title: Adhesive silicone composition and an adhesive film or tape
-
Application No.: US16961371Application Date: 2019-01-15
-
Publication No.: US11702574B2Publication Date: 2023-07-18
- Inventor: Ken Nakayama , Yasuyoshi Kuroda
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Rimon, P.C.
- Priority: JP 18004825 2018.01.16
- International Application: PCT/JP2019/000909 2019.01.15
- International Announcement: WO2019/142779A 2019.07.25
- Date entered country: 2020-07-10
- Main IPC: C09J183/06
- IPC: C09J183/06 ; C08K3/011 ; C08K3/11 ; C09J7/22 ; C09J7/38 ; C08G77/08 ; C08G77/12

Abstract:
An adhesive silicone composition having (A) a linear or branched organopolysiloxane having at least two alkenyl groups in a molecule (B) an organopolysiloxane comprising R23SiO1/2 units and SiO4/2 units, wherein R2 is, independently of each other, a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 10 carbon atoms, (C) an organohydrogenpolysiloxane having at least three hydrogen atoms each bonded to a silicon atom in a molecule and having no aryl group, and (E) an organohydrogenpolysiloxane having at least three hydrogen atoms each bonded to a silicon atom in a molecule and having an aryl group-containing organic group.
Public/Granted literature
- US20200347281A1 ADHESIVE SILICONE COMPOSITION AND AN ADHESIVE FILM OR TAPE Public/Granted day:2020-11-05
Information query
IPC分类: