Invention Grant
- Patent Title: Multi-channel thin heat exchanger and manufacturing method of the same
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Application No.: US17154923Application Date: 2021-01-21
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Publication No.: US11703287B2Publication Date: 2023-07-18
- Inventor: Jen-chih Cheng
- Applicant: Cooler Master Co., Ltd.
- Applicant Address: TW New Taipei
- Assignee: COOLER MASTER CO., LTD.
- Current Assignee: COOLER MASTER CO., LTD.
- Current Assignee Address: TW Taipei
- Agency: McDermott Will & Emery LLP
- Main IPC: F28F3/00
- IPC: F28F3/00 ; F28F3/12 ; H05K7/20 ; F28F3/14

Abstract:
A heat dissipation device includes a body including a first metal sheet and a second metal sheet coupled to the first metal sheet. The first metal sheet at least partially defines a first channel including a first plurality of curves, a second channel including a second plurality of curves, and an interconnecting channel fluidly coupled to the first channel and the second channel. The first channel and the interconnecting channel at least partially surround the second channel, a unit volume of the first channel is a same as a unit volume of the interconnecting channel, and the unit volumes of the first channel and the interconnecting channel are different from a unit volume of the second channel.
Public/Granted literature
- US20210222964A1 MULTI-CHANNEL THIN HEAT EXCHANGER AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2021-07-22
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