Invention Grant
- Patent Title: Heat-sound-vibration three-parameter integrated in-situ sensor and system of high-temperature-resistant and high-pressure-resistant structure
-
Application No.: US17667760Application Date: 2022-02-09
-
Publication No.: US11703377B2Publication Date: 2023-07-18
- Inventor: Yongqiu Zheng , Chenyang Xue , Jinge Guan , Pinggang Jia , Xinyu Zhao , Chen Chen , Jiamin Chen , Liyun Wu , Yuan Han
- Applicant: North University of China
- Applicant Address: CN Taiyuan
- Assignee: NORTH UNIVERSITY OF CHINA
- Current Assignee: NORTH UNIVERSITY OF CHINA
- Current Assignee Address: CN Taiyuan
- Agency: Hauptman Ham, LLP
- Priority: CN 2110173827.2 2021.02.09
- Main IPC: G01H17/00
- IPC: G01H17/00

Abstract:
The present disclosure relates to a thermal-acoustic-vibration three-parameter integrated in-situ sensor and system with a high-temperature-resistant and high-pressure-resistant structure. The provided thermal-acoustic-vibration three-parameter integrated in-situ sensor with a high-temperature-resistant and high-pressure-resistant structure comprises a heat detection device, a sound detection device and a vibration detection device; and the sound detection device and the vibration detection device are distributed on two sides of the heat detection device. When heat, sound and vibration need to be detected, only spectra of light signals emitted by the heat detection device, the sound detection device and the vibration detection device need to be obtained, and heat information, sound information and vibration information to be detected are obtained through the corresponding relation between the spectra of the optical signals emitted by the heat detection device, the sound detection device and the vibration detection device and heat information, sound information and vibration information to be detected.
Public/Granted literature
Information query