- Patent Title: Pixel array substrate comprising a plurality of signal lines disposed on a plurality of insulation patterns each having at least one recess structure filled with the signal lines
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Application No.: US17519564Application Date: 2021-11-04
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Publication No.: US11703732B2Publication Date: 2023-07-18
- Inventor: Chia-Hui Pai , Wen-Hsien Tseng
- Applicant: Au Optronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW 9146835 2020.12.30
- Main IPC: G02F1/1362
- IPC: G02F1/1362

Abstract:
A pixel array substrate including a substrate, multiple insulation patterns, multiple signal lines, and multiple pixel structures is provided. The insulation patterns are disposed on the substrate, and each has at least one recess structure. The signal lines are respectively disposed on the insulation patterns and are respectively filled in the at least one recess structure of one of the insulation patterns. The pixel structures are disposed on the substrate and are electrically connected to the signal lines. A pixel array substrate further including multiple conductive patterns is also disposed.
Public/Granted literature
- US20220206350A1 PIXEL ARRAY SUBSTRATE Public/Granted day:2022-06-30
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