Invention Grant
- Patent Title: Thermal interface material structures for directing heat in a three-dimensional space
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Application No.: US17852711Application Date: 2022-06-29
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Publication No.: US11703922B2Publication Date: 2023-07-18
- Inventor: Mark K. Hoffmeyer , Christopher M. Marroquin , Eric J. Campbell , Sarah K. Czaplewski-Campbell , Phillip V. Mann
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agent Nathan M. Rau
- The original application number of the division: US16847144 2020.04.13
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.
Public/Granted literature
- US20220334625A1 THERMAL INTERFACE MATERIAL STRUCTURES FOR DIRECTING HEAT IN A THREE-DIMENSIONAL SPACE Public/Granted day:2022-10-20
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