Invention Grant
- Patent Title: System, apparatus and method for extended communication modes for a multi-drop interconnect
-
Application No.: US17479001Application Date: 2021-09-20
-
Publication No.: US11704274B2Publication Date: 2023-07-18
- Inventor: Amit Kumar Srivastava
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/38 ; G06F13/42

Abstract:
In one embodiment, an apparatus includes a host controller to couple to an interconnect to which a plurality of devices may be coupled. The host controller may include: a first driver to drive first information onto a first line of the interconnect; a second driver to drive a clock signal onto a second line of the interconnect; and a mode control circuit to cause the second driver to drive the clock signal onto the second line of the interconnect in a first mode and to cause the first driver and the second driver to drive differential information onto the first line and the second line of the interconnect in a second mode. Other embodiments are described and claimed.
Public/Granted literature
- US20220004516A1 System, Apparatus And Method For Extended Communication Modes For A Multi-Drop Interconnect Public/Granted day:2022-01-06
Information query