Invention Grant
- Patent Title: High-speed buffer amplifier
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Application No.: US17585087Application Date: 2022-01-26
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Publication No.: US11705084B1Publication Date: 2023-07-18
- Inventor: Chih-Wen Lu
- Applicant: Himax Technologies Limited
- Applicant Address: TW Tainan
- Assignee: Himax Technologies Limited
- Current Assignee: Himax Technologies Limited
- Current Assignee Address: TW Tainan
- Agency: Stout, Uxa & Buyan, LLP
- Agent Donald E. Stout
- Main IPC: H03F3/45
- IPC: H03F3/45 ; G09G3/36 ; H03F3/345 ; H03F3/30

Abstract:
A high-speed buffer amplifier includes an input stage including a first channel coupled to receive differential inputs and a second channel coupled to receive the differential inputs; a middle stage including a first current source coupled to receive outputs of the second channel and electrically connected to power, a second current source coupled to receive outputs of the first channel and electrically connected to ground, and a floating current source electrically connected between the first current source and the second current source; and an output stage coupled to the middle stage to generate an output voltage. A shunt circuit is electrically connected between the first current source and the second current source, and configured to bypass the floating current source.
Public/Granted literature
- US20230237973A1 HIGH-SPEED BUFFER AMPLIFIER Public/Granted day:2023-07-27
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