A multilayer ceramic capacitor includes: a multilayer chip in which dielectric layers mainly composed of ceramic and internal electrode layers are alternately stacked so that the internal electrode layers are alternately exposed to two end faces of the multilayer chip having a substantially rectangular parallelepiped shape; and a pair of external electrodes formed from the two end faces to at least one side face of side faces, wherein each external electrode includes a metal layer formed from the end face to the at least one side face and mainly composed of copper, and an oxide layer covering at least a part of the metal layer, mainly composed of copper oxide, and having a maximum thickness of 0.5 μm or greater, wherein a first surface, which is in contact with the plated layer, of the oxide layer has Cu particles formed thereon.