- Patent Title: Semiconductor-on-insulator (SOI) substrate and method for forming
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Application No.: US17701103Application Date: 2022-03-22
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Publication No.: US11705328B2Publication Date: 2023-07-18
- Inventor: Cheng-Ta Wu , Chia-Ta Hsieh , Kuo Wei Wu , Yu-Chun Chang , Ying Ling Tseng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/762 ; H01L21/84 ; H01L27/12 ; H01L29/06

Abstract:
Various embodiments of the present application are directed towards a semiconductor-on-insulator (SOI) substrate. The SOI substrate includes a handle substrate; a device layer overlying the handle substrate; and an insulator layer separating the handle substrate from the device layer. The insulator layer meets the device layer at a first interface and meets the handle substrate at a second interface. The insulator layer comprises a getter material having a getter concentration profile. The handle substrate contains getter material and has a handle getter concentration profile. The handle getter concentration profile has a peak at the second interface and a gradual decline beneath the second interface until reaching a handle getter concentration.
Public/Granted literature
- US20220216053A1 SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING Public/Granted day:2022-07-07
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