Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US17223141Application Date: 2021-04-06
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Publication No.: US11705346B2Publication Date: 2023-07-18
- Inventor: Yusei Kuwabara , Takahiro Senda
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP 20069209 2020.04.07
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01J37/32

Abstract:
An upper member is disposed at an upper portion within a processing chamber. A ceiling member forms a ceiling of the processing chamber, and is provided with a through hole at a facing surface thereof which faces the upper member. A supporting member supports the upper member with a first end thereof located inside the processing chamber by being inserted through the through hole and slid within the through hole. An accommodation member accommodates therein a second end of the supporting member located outside the processing chamber, and is partitioned into a first space at a first end side and a second space at a second end side in a moving direction with respect to the second end. A pressure controller generates a pressure difference between the first space and the second space. The pressure difference allows the supporting member to be moved.
Public/Granted literature
- US20210313201A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2021-10-07
Information query
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