Invention Grant
- Patent Title: System and method for providing an electrical ground connection for a circuit assembly
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Application No.: US17248494Application Date: 2021-01-27
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Publication No.: US11706867B2Publication Date: 2023-07-18
- Inventor: Joan Balana Avila , Josep Maria Combalia , Gloria Simo Quinonero , Jordi Angel Serrano
- Applicant: Lear Corporation
- Applicant Address: US MI Southfield
- Assignee: LEAR CORPORATION
- Current Assignee: LEAR CORPORATION
- Current Assignee Address: US MI Southfield
- Agency: Brooks Kushman P.C.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K5/00 ; H01R4/30 ; H01R4/64 ; H01R12/71 ; H01R13/621

Abstract:
A system is described for providing an electrical ground connection for a circuit assembly. The system may include a housing for the circuit assembly, the housing having an electrically conductive fixation member configured for attachment to an electrically conductive element outside the housing. The system may also include an electrically conductive feature having a first end and a second end, the first end configured to cooperate with the electrically conductive fixation member inside the housing and the second end configured for attachment to the circuit assembly. Attachment of the electrically conductive fixation member to the electrically conductive element outside the housing enables an electrical ground connection for the circuit assembly via the electrically conductive feature.
Public/Granted literature
- US20220240371A1 SYSTEM AND METHOD FOR PROVIDING AN ELECTRICAL GROUND CONNECTION FOR A CIRCUIT ASSEMBLY Public/Granted day:2022-07-28
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