The present disclosure discloses a multilayer circuit board comprising a plurality of metal layers, a blind via and/or a buried via, the multilayer circuit board is capable of transmitting signal between the different metal layers. The blind via has a pad on a non-opening side of the blind via. An upper or lower layer metal layer on the non-opening side of the blind via adjacent to the blind via has a first hole which is located in a position corresponding to the pad on the non-opening side of the blind via in a depth direction of the blind via; and/or an upper and/or lower layer adjacent to the buried via has a second hole which is located in a position corresponding to the pad of an upper and/or lower orifice of the buried via in a depth direction of the buried via.