Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
-
Application No.: US17331926Application Date: 2021-05-27
-
Publication No.: US11706930B2Publication Date: 2023-07-18
- Inventor: Tzu-Yu Chen , Sheng-Hung Shih , Fu-Chen Chang , Kuo-Chi Tu , Wen-Ting Chu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H10B53/30 ; H01L49/02 ; H01L21/02

Abstract:
A semiconductor device includes a bottom electrode, a top electrode, a sidewall spacer, and a data storage element. The sidewall spacer is disposed aside the top electrode. The data storage element is located between the bottom electrode and the top electrode, and includes a ferroelectric material. The data storage element has a peripheral region which is disposed beneath the sidewall spacer and which has at least 60% of ferroelectric phase. A method for manufacturing the semiconductor device and a method for transforming a non-ferroelectric phase of a ferroelectric material to a ferroelectric phase are also disclosed.
Public/Granted literature
- US20220384464A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-12-01
Information query
IPC分类: