Invention Grant
- Patent Title: Pressure sensing implant
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Application No.: US16298356Application Date: 2019-03-11
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Publication No.: US11707230B2Publication Date: 2023-07-25
- Inventor: Harry Rowland , Michael Nagy , Balamurugan Sundaram , Suresh Sundaram
- Applicant: ENDOTRONIX, INC.
- Applicant Address: US IL Lisle
- Assignee: ENDOTRONIX, INC.
- Current Assignee: ENDOTRONIX, INC.
- Current Assignee Address: US IL Lisle
- Agency: McDonald Hopkins LLC
- Main IPC: B81C1/00
- IPC: B81C1/00 ; A61B5/00 ; A61B5/0215 ; A61B5/07 ; G01L19/06 ; G01L9/00 ; H05K9/00 ; B81B3/00 ; G01L19/00

Abstract:
A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.
Public/Granted literature
- US20190200928A1 PRESSURE SENSING IMPLANT Public/Granted day:2019-07-04
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