Invention Grant
- Patent Title: Linkage device, transceiver module and plane stress field measuring device and method capable of achieving synchronous adjustment of distance and angle
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Application No.: US17552467Application Date: 2021-12-16
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Publication No.: US11709152B2Publication Date: 2023-07-25
- Inventor: Weijia Shi , Jiaxin Li , Bo Zhao , Jiubin Tan
- Applicant: Harbin Institute of Technology
- Applicant Address: CN Harbin
- Assignee: HARBIN INSTITUTE OF TECHNOLOGY
- Current Assignee: HARBIN INSTITUTE OF TECHNOLOGY
- Current Assignee Address: CN Harbin
- Agency: IPro, PLLC
- Priority: CN 2111220083.1 2021.10.20
- Main IPC: G01N29/26
- IPC: G01N29/26 ; G01B17/00 ; G01N29/07

Abstract:
Disclosed are a linkage device, a transceiver module and a plane stress field measuring device and method capable of achieving synchronous adjustment of distance and angle, and relates to the field of ultrasonic non-destructive testing. The existing technical means for measuring plane stress in the field of ultrasonic testing has the shortcomings that the same testing is only applicable for single materials and the deflection angles of transmitting and receiving transducers are inconsistent. In the application, the linkage device designed by comprising a distance adjusting screw, an angle adjusting screw, a left connecting rod, a right connecting rod, a shaft column and a column lock is adopted, and based on the linkage device, the transceiver module designed by comprising a receiving end wedge, a receiving probe, a transmitting end wedge and a transmitting probe is additionally arranged; based on the transceiver module, the measuring device designed by comprising a pulse transmitting device, an amplifying device and a data acquisition device is additionally arranged, and the stress measuring method applicable for the stress measuring device is provided; and the distance and deflection angle between the receiving probe and the transmitting probe of the detection are adjusted according to a tested part. The application applies to stress measurement in the manufacturing process of mechanical components.
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