Two or more die are stacked together in a stacked integrated circuit device. Each of the processors on these die is able to communicate with other processors on its die by sending data over the switching fabric of its respective die. The mechanism for sending data between processors on the same die (i.e. intradie communication) is reused for sending data between processors on different die (i.e. interdie communication). The reuse of the mechanism is enabled by assigning each processor a vertical neighbour on its opposing die. Each processor has an interdie connection that connects it to the output exchange bus of its neighbour. A processor is able to borrow the output exchange bus of its neighbour by sending data along the output exchange bus of its neighbour.