Invention Grant
- Patent Title: One-way communication data diode on a chip
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Application No.: US18068316Application Date: 2022-12-19
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Publication No.: US11709970B1Publication Date: 2023-07-25
- Inventor: Sang Cheon Lee , Colin Patrick Dunn
- Applicant: Fend Incorporated
- Applicant Address: US VA Arlington
- Assignee: Fend Incorporated
- Current Assignee: Fend Incorporated
- Current Assignee Address: US VA Arlington
- Agency: Schafer IP Law
- Agent Richard A. Schafer
- Main IPC: G06F21/71
- IPC: G06F21/71 ; H05K1/18 ; H05K1/02
Abstract:
A data diode chip provides a flexible device for collecting data from a data source and transmitting the data to a data destination using one-way data transmission. On-chip processing elements allow the data diode to identify automatically the type of connectivity provided to the data diode and configure the data diode to handle the identified type of connectivity.
Information query
