Invention Grant
- Patent Title: Semiconductor structure with improved source drain epitaxy
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Application No.: US17341088Application Date: 2021-06-07
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Publication No.: US11710792B2Publication Date: 2023-07-25
- Inventor: Wei-Yang Lee , Tzu-Hsiang Hsu , Ting-Yeh Chen , Feng-Cheng Yang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/8238 ; H01L27/092 ; H01L29/66 ; H10B10/00 ; H01L21/84 ; H01L29/08 ; H01L29/16 ; H01L29/161 ; H01L29/165

Abstract:
A semiconductor structure includes a substrate, first fins extending from the substrate with a first fin pitch, and second fins extending from the substrate with a second fin pitch smaller than the first fin pitch. The semiconductor structure also includes first gate structures engaging the first fins with a first gate pitch and second gate structures engaging the second fins with a second gate pitch smaller than the first gate pitch. The semiconductor structure also includes first epitaxial semiconductor features partially embedded in the first fins and adjacent the first gate structures and second epitaxial semiconductor features partially embedded in the second fins and adjacent the second gate structures. A bottom surface of the first epitaxial semiconductor features is lower than a bottom surface of the second epitaxial semiconductor features.
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