Invention Grant
- Patent Title: Shield case and electronic circuit module
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Application No.: US17211796Application Date: 2021-03-24
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Publication No.: US11711889B2Publication Date: 2023-07-25
- Inventor: Mitsuhiro Nakamura
- Applicant: LAPIS Semiconductor Co., Ltd.
- Applicant Address: JP Yokohama
- Assignee: LAPIS Semiconductor Co., Ltd.
- Current Assignee: LAPIS Semiconductor Co., Ltd.
- Current Assignee Address: JP Yokohama
- Agency: JCIPRNET
- Priority: JP 20057114 2020.03.27
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/34 ; H05K9/00

Abstract:
A shield case, joined to a circuit board on which electronic components are mounted and covering the electronic components, has a top plate portion covering the electronic components, and a plurality of terminal leg portions formed in a way of projecting in a direction intersecting with the top plate portion from a peripheral edge portion of the top plate portion. Each of the plurality of terminal leg portions has: a leg portion stretching from the top plate portion; a terminal portion which extends in a direction intersecting with the leg portion from a front-end of the leg portion and is joined to the circuit board; and an expansion terminal portion which is formed by bending a front-end portion of each of the terminal portions along an end surface of the circuit board and has a length exceeding a thickness of the circuit board.
Public/Granted literature
- US20210307154A1 SHIELD CASE AND ELECTRONIC CIRCUIT MODULE Public/Granted day:2021-09-30
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