Invention Grant
- Patent Title: Expandable intervertebral implant
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Application No.: US17001718Application Date: 2020-08-25
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Publication No.: US11712341B2Publication Date: 2023-08-01
- Inventor: Christopher Marden John Cain
- Applicant: DePuy Synthes Products, Inc.
- Applicant Address: US MA Raynham
- Assignee: DePuy Synthes Products, Inc.
- Current Assignee: DePuy Synthes Products, Inc.
- Current Assignee Address: US MA Raynham
- Agency: BakerHostetler
- Main IPC: A61F2/44
- IPC: A61F2/44 ; A61F2/46 ; A61F2/28 ; A61F2/30

Abstract:
An expandable intervertebral implant is provided for insertion into an intervertebral space defined by adjacent vertebrae. The expandable intervertebral implant includes a pair of outer sleeve portions and an inner core disposed between the outer sleeve portions. Movement of the inner core relative to the outer sleeve portions causes the outers sleeve portions to deflect away from each other, thereby engaging the expandable intervertebral implant with the vertebrae and adjusting the height of the intervertebral space.
Information query
IPC分类: