Invention Grant
- Patent Title: Medical implant of the type of a wrap-around cuff electrode assembly
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Application No.: US17266363Application Date: 2019-08-05
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Publication No.: US11712558B2Publication Date: 2023-08-01
- Inventor: Dennis Plachta , Fabian Kimmig , Tim Boretius
- Applicant: Neuroloop GmbH
- Applicant Address: DE Freiburg
- Assignee: NEUROLOOP GMBH
- Current Assignee: NEUROLOOP GMBH
- Current Assignee Address: DE Freiburg
- Agency: Fitch, Even, Tabin & Flannery LLP
- Priority: DE 2018213120.1 2018.08.06
- International Application: PCT/EP2019/071025 2019.08.05
- International Announcement: WO2020/030592A 2020.02.13
- Date entered country: 2021-02-05
- Main IPC: A61N1/05
- IPC: A61N1/05 ; A61N1/36

Abstract:
The invention is a medical implant which is a wrap-around cuff comprising a flexible, biocompatible, film carrier substrate, that has a carrier substrate region which is wrapped around a wrap axis to form a tube. The invention has a protective structure directly or indirectly attached to the carrier substrate, which can be transformed from a first, open state into a second closed state that encloses the carrier substrate region that is wrapped to form a tube at least axially around a wrapping axis extending in the peripheral direction of the tube.
Public/Granted literature
- US20210316138A1 MEDICAL IMPLANT OF THE TYPE OF A WRAP-AROUND CUFF ELECTRODE ASSEMBLY Public/Granted day:2021-10-14
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