Hole-saws are provided herein, and more specifically to hole-saw assemblies and processes having adjustable platters for multiple simultaneous saw components, optional elimination of a guide drill, and the ability to retrieve cores of a sawed work piece before sawing completely through the workpiece. One hole-saw device, may have a motive force; a base plate rotatable by the motive force; cutters; and locking mechanisms to mount the base plate to the cutters.