A laser cutting method includes a step of determining a material to be removed and dividing the material to be removed into a plurality of material chips so as thereby to organize a machining plan for laser cutting; and, a step of, according to the machining plan for laser cutting, moving a laser along a boundary defining the material to be removed on the workpiece to perform cutting in a first direction and a second direction, such that the material chips can be separated from the workpiece orderly piece by piece so as to form a specific pattern. While in laser cutting, the method removes the material piece by piece. With the laser to remove the material chips through cutting along the boundary, the pattern on the workpiece is thus finished equivalently by the laser. Thereupon, the machining time can be significantly reduced.