- Patent Title: Layered bonding material, semiconductor package, and power module
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Application No.: US17793866Application Date: 2021-03-19
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Publication No.: US11712760B2Publication Date: 2023-08-01
- Inventor: Naoto Kameda , Masato Tsuchiya , Katsuji Nakamura , Osamu Munekata , Kaichi Tsuruta
- Applicant: SENJU METAL INDUSTRY CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SENJU METAL INDUSTRY CO., LTD.
- Current Assignee: SENJU METAL INDUSTRY CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP 20050674 2020.03.23
- International Application: PCT/JP2021/011341 2021.03.19
- International Announcement: WO2021/193420A 2021.09.30
- Date entered country: 2022-07-19
- Main IPC: B23K35/02
- IPC: B23K35/02 ; B23K35/26 ; B32B15/01 ; H01L23/367 ; H01L23/00 ; B23K101/40
Abstract:
In a layered bonding material 10, a coefficient of linear expansion of a base material 11 is 5.5 to 15.5 ppm/K and a first surface and a second surface of the base material 11 are coated with pieces of lead-free solder 12a and 12b.
Public/Granted literature
- US20230039027A1 LAYERED BONDING MATERIAL, SEMICONDUCTOR PACKAGE, AND POWER MODULE Public/Granted day:2023-02-09
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