Invention Grant
- Patent Title: Device for cutting structure and method for cutting structure
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Application No.: US16499682Application Date: 2018-03-20
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Publication No.: US11712763B2Publication Date: 2023-08-01
- Inventor: Yoshinobu Hosaka , Daisuke Muraoka , Takanori Yamasaki
- Applicant: KOBELCO CONSTRUCTION MACHINERY CO., LTD.
- Applicant Address: JP Hiroshima
- Assignee: KOBELCO CONSTRUCTION MACHINERY CO., LTD.
- Current Assignee: KOBELCO CONSTRUCTION MACHINERY CO., LTD.
- Current Assignee Address: JP Hiroshima
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP 17077126 2017.04.07
- International Application: PCT/JP2018/011113 2018.03.20
- International Announcement: WO2018/186171A 2018.10.11
- Date entered country: 2019-09-30
- Main IPC: B23K37/02
- IPC: B23K37/02 ; B23K37/04 ; E02F3/96 ; E04G23/08 ; B23K7/10 ; B23K7/00 ; B23K103/04

Abstract:
A cutting device capable of efficiently cutting an object with a simple configuration includes a grasp unit including a first grasper and a second grasper movable in an opening and closing directions to grasp the object, a cutting unit disposed side by side with the first and second graspers and moved in a cutting direction along the opening and closing directions to cut the object, and a position setter setting a cutting start position and a cutting end position based on respective positions of the first and second graspers that are grasping the object, respectively.
Public/Granted literature
- US20210187674A1 DEVICE FOR CUTTING STRUCTURE AND METHOD FOR CUTTING STRUCTURE Public/Granted day:2021-06-24
Information query
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