Invention Grant
- Patent Title: Diode laser fiber array for contour of powder bed fabrication or repair
-
Application No.: US17397011Application Date: 2021-08-09
-
Publication No.: US11712765B2Publication Date: 2023-08-01
- Inventor: David Charles Bogdan, Jr. , Jason Harris Karp , William Thomas Carter
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Dority & Manning, P.A.
- Main IPC: B33Y10/00
- IPC: B33Y10/00 ; B33Y30/00 ; B23P6/00 ; H01S5/40 ; G02B6/42 ; B29C64/153 ; B28B1/00 ; C03B19/01 ; F01D5/00 ; B23K26/342 ; B23K26/10 ; B23K26/06 ; B23K26/08 ; B23K26/0622 ; B23K26/00 ; B29C64/277 ; B33Y80/00 ; B29C64/393 ; B33Y50/02 ; B23K103/00 ; B23K103/18

Abstract:
A method of forming a build in a powder bed includes providing a first diode laser fiber array and a second diode laser fiber array, emitting a plurality of laser beams from selected fibers of the second diode laser fiber array onto the powder bed, corresponding to a pattern of a layer of the build, simultaneously melting powder in the powder bed corresponding to the pattern of the layer of the build, scanning a first diode laser fiber array along an outer boundary of the powder bed and emitting a plurality of laser beams from selected fibers of the first diode laser fiber array and simultaneously melting powder in the powder bed corresponding to the outer boundary of the layer of the build to contour the layer of the build. An apparatus for forming a build in a powder bed including a first diode laser fiber array and a second diode laser fiber array is also disclosed. The first diode laser fiber array configured to contour the layer of the build.
Public/Granted literature
- US20210370448A1 DIODE LASER FIBER ARRAY FOR CONTOUR OF POWDER BED FABRICATION OR REPAIR Public/Granted day:2021-12-02
Information query