Invention Grant
- Patent Title: Molding die for compression molding with resin leakage prevention member
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Application No.: US17408389Application Date: 2021-08-21
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Publication No.: US11712823B2Publication Date: 2023-08-01
- Inventor: Yusuke Yoshida , Yohei Onishi
- Applicant: TOWA CORPORATION
- Applicant Address: JP Kyoto
- Assignee: TOWA CORPORATION
- Current Assignee: TOWA CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: JP 20143050 2020.08.26
- Main IPC: B29C43/36
- IPC: B29C43/36

Abstract:
The present invention provides a resin leakage prevention member 401 for use in a molding die 1000, wherein the molding die 1000 includes a lower die 200 and an upper die 100, the lower die 200 has a side member 201 and a bottom member 202, a space surrounded by the side member 201 and the bottom member 202 forms a cavity 204, the cavity 204 is configured to accommodate a resin material 20a, the side member 201 is configured to move relatively vertical to the bottom member 202, and the resin leakage prevention member 401 is disposed on a peripheral portion of an upper surface of the bottom member 202 and along an inner peripheral surface of the side member 201, thereby sealing a gap between the side member 201 and the bottom member 202 and preventing a resin from leaking from the cavity 204 into the gap.
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